Wafer-scale InSe transistors with record electron mobility and low power use could power the next generation of AI chips.

The semiconductor wafer market is experiencing robust growth as the demand for high-performance, energy-efficient, and miniaturized electronic components continues to accelerate across industries.

Researchers used a solid-liquid-solid method to fabricate wafer-scale 2D InSe, solving key challenges in next-gen ...

Multibeam Corp. has raised $31 million in Series B funds from global investors led by Onto Innovation Inc., a leader in ...

Q2 2025 Earnings Call Transcript August 1, 2025 Operator: Good morning, ladies and gentlemen, and welcome to the Element ...

The PCB now takes on additional responsibilities by incorporating fine-pitch redistribution layers (RDL) through advanced HDI ...

TSMC's first generation of SoW packaging involved mounting just the processing dies to the wafer, whereas the new version ...

Contributor content. The success of TSMC's Arizona venture suggests that America's semiconductor manufacturing revival has ...

NVIDIA is considering moving to CoWoP advanced packaging for its next-gen Rubin GPUs: removes substrate, connects interposer ...

Investors include Onto Innovation, Lam Capital, UMC Capital, and MediaTek Capital Multibeam System Multibeam's ...

TSMC has scaled back investment in mature process nodes to better meet customer demand and optimize resources. It involves ...

Vietnamese chip component suppliers are responding to growing market demands for products with no Chinese link.