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This paper investigates the thermal performance of multi-layer metal interconnects in three-dimensional (3D) stacked structures through finite element analysis (FEA). The 3D integrated circuit (3D IC) ...

CMOS 2.0: Layered Logic For The Post-Nanosheet Era imec’s 3D platform upends the way devices are built. Focus shifts from transistors to systems.

A defective through-silicon via (TSV) may cause a small delay fault that is difficult to detect using conventional logic testing methods. Testing TSVs used for chip-to-chip interconnection in 3D ...