Space Seed Holdings Inc. (Head Office: Minato-ku, Tokyo; CEO: Kengo Suzuki, hereinafter “the Company”) has commenced technological development on next-generation Spark Plasma Sintering (SPS ...

Bonding pressure is one of the most important process parameters in pressure-assisted sintering bonding of the SiC power chips. The buffer film, placed between the pressure indenter and the chips, is ...

Americarb has launched a commercial-grade Ceramic Matrix Composite (CMC) designed for sintering metal powder parts.