A new technical paper titled “Benchmarking Ultra-Low-Power μNPUs” was published by researchers at Imperial College London and ...

A new technical paper titled “PPAC Driven Multi-die and Multi-technology Floorplanning” was published by Texas A&M University ...

Tariff questions, impact; Europe's chiplets focus; DARPA's quantum push; Intel 18A enters risk production; optical networking ...

A new technical paper titled “Design of Energy-Efficient Cross-coupled Differential Photonic-SRAM (pSRAM) Bitcell for ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible ...

Deploying GenAI on edge devices offers several compelling advantages, particularly in applications where real-time processing ...

More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

Semiconductor verification is changing to integrate AI with human expertise.

SE: With all these thermal issues and growing complexity of these multi-die assemblies, are there new kinds of stress testing ...

AI chips and data center communications see big funding; 75 startups raise $2 billion. The first quarter of 2025 saw six ...

Other markets include a hodgepodge of often ineffective approaches, but changes are coming as the value of connected assets ...

SE: What is a digital twin in the context of chip development?