Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...

From solar energy optimization to infection-fighting medical devices, AltaSim Technologies is transforming product ...

uPI achieves a 2X improvement in thermal cycle endurance for their semiconductor product packages with Ansys' multiphysics simulation solutions Ansys' predictive simulation insights enable uPI to ...

29% of thermal engineers are having to compromise the accuracy of their simulations due to hardware limitations, according to The State of Thermal, a survey of over 170 thermal engineers conducted by ...

Simulate satellite thermal behavior in orbit. Explore how a Monte Carlo model demonstrates temperature changes as it moves ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

With concerns over air pollution and petroleum supplies, the use of hybrid electric vehicles (HEVs) and electric vehicles (EVs) have come to the forefront as alternatives to conventional gasoline and ...