SAN JOSE, Calif. — Wafer-level packaging (WLP)–the fabrication of the IC package directly on the wafer–is finally moving into the spotlight after years' of promises, according to an expert in the ...
What should you do If you don’t have enough room on your floor to store all your old boxes? Luckily, we live in a 3D world, and you can start stacking them on top of each other. The Challenge: How can ...
FREMONT, CA / ACCESS Newswire / August 26, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received a purchase order ...
LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...
FREMONT, CA / ACCESS Newswire / November 3, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced a strategic partnership with ISE ...
While contact gate pitch (GP) and fin pitch (FP) scaling continues to provide higher performance and lower power to finFET platforms, controlling RC parasitics and achieving higher transistor ...
SAN JOSE, Calif. — Citing renewed demand, Singapore's STATS ChipPAC Ltd. is expanding its capacity for wafer-level packaging. STATS ChipPAC has been on a production ramp with wafer-level packaging ...
The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend services will ...
Although it requires a new generation of test equipment, testing MEMS devices is challenging but not impossible. Since the early days of the IC industry, wafer-level test has been possible using ...
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