TOKYO-- (BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a ...

Soitec and Resonac announce the signing of a joint development agreement in SmartSiC™ to accelerate high-performance silicon carbide adoption in next-generation electric vehicles. Tokyo and ...

Japan's Resonac to open chip packaging R&D centre in US By Sam Nussey November 21, 20238:00 PM PSTUpdated November 21, 2023 ...

Resonac Holdings Corp. is ready to spend hundreds of billions of yen on chip acquisitions, as the 84-year-old chemicals giant seeks to boost its role as a pivotal supplier to global giants like ...