LAS VEGAS, NV, UNITED STATES, January 20, 2026 /EINPresswire.com/ — CIT (CEO Seung Jeong) announced its participation in CES 2026, the world’s largest IT and consumer electronics exhibition, held in ...
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How science is redefining modern packaging
The packaging industry plays a pivotal role in product protection, consumer convenience, and, more recently, in environmental ...
The patent pending packaging is made with a PE-based recyclable film designed to replace laminated, nonrecyclable structures used in snack packaging. ProAmpac's new ProActive Recyclable R-2200 ...
Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...
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Technological advancements in packaging
Packaging has evolved far beyond its traditional role of protecting products. Today, it serves as a dynamic interface between brands and consumers, influenced by technological innovations that enhance ...
FALL RIVER, Mass.--(BUSINESS WIRE)-- Packaging Technology Group, Inc (PTG), a leading provider of thermal packaging solutions and services for the biopharmaceutical and life sciences sector, announced ...
Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.
Opening marks a milestone for high-volume manufacturing of 3D advanced packaging technologies. RIO RANCHO, N.M.--(BUSINESS WIRE)--What’s New: Today, Intel celebrated the opening of Fab 9, its ...
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...
2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...
The MicroLeadframe (MLF/QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent a >111B-unit market for 2022 ...
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