Nvidia has been working on a prototype multi-die AI accelerator chip called RC 18. The 36-module strong chip, developed by Nvidia Research, is currently being evaluated in the labs, and its highly ...
In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...
Taiwan's major outsourced semiconductor assembly and test (OSAT) service providers, including ASE Group, Powertech Technology, King Yuan Electronics (KYEC), and Sigurd Microelectronics, are expected ...
Multi-chip module (MCM) graphics cards just might be the future, bringing upcoming generations of GPUs to a whole new level. Combining multiple dies instead of relying on a single chip could provide ...
“More than Moore technologies can be supported by system-level diversification enabled by chiplet-based integrated systems within multichip modules (MCMs) and silicon interposer-based 2.5-D systems.
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