EDN

Keithley Debuts IC Reliability Tester

Keithley Instruments has announced the S510, a high-channel-count, turnkey semiconductor reliability test system for use in lifetime modeling of advanced ULSI CMOS processes at the 65-nm node and ...
Nasdaq

Ansys Collaborates with TSMC and Microsoft to Accelerate Mechanical Stress Simulation for 3D-IC Reliability in the Cloud

PITTSBURGH, Nov. 16, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems ...
Business Wire

IROC to Introduce TFIT™ 2 at IRPS 2012 to Allow IC Designers to Analyze and Prevent Soft Errors at Lower Geometries

ANAHEIM, Calif.--(BUSINESS WIRE)--IRPS Conference --IROC Technologies ®, developers of the industry standard for integrated circuit (IC) soft error analysis and ...
Business Wire

Cadence Debuts Industry’s First Analog IC Design-for-Reliability Solution

MUNICH--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced the Cadence ® Legato™ Reliability Solution, the industry’s first software product that meets the challenges of ...
Semiconductor Engineering

IC Reliability Burden Shifts Left

Chip reliability is coming under much tighter scrutiny as IC-driven systems take on increasingly critical and complex roles. So whether it’s a stray alpha particle that flips a memory bit, or some ...
Electronic Design

Georgia Tech wins DARPA contract on 3-D IC cooling and reliability

Georgia Tech reports that is has won a 3-year, $2.9 million DARPA contract to develop 3-D chip cooling technology. The goal is to handle heat loads as much as ten times greater than those exhibited by ...
Semiconductor Engineering

Silicon Lifecycle Management’s Growing Impact On IC Reliability

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management, how it’s expanding and changing, and where the problems are, with Prashant Goteti, principal ...
Machine Design

Film Test for Better ICs

As IC electronics have become more densely packed, cross-talk among them has become a problem As IC electronics have become more densely packed, cross-talk among them has become a problem. One means ...
Morningstar

Power Integrations’ 1700 V Switcher IC Delivers Reliability and Space-Saving Benefits in 800 V BEVs

Power Integrations’ 1700 V Switcher IC Delivers Reliability and Space-Saving Benefits in 800 V BEVs Performance of InnoSwitch™3-AQ flyback IC demonstrated in new reference designs featuring ...
Machine Design

6 Ways to Make Reliability Tests More…Well, Reliable

Reliability tests are a crucial part of the manufacturing process, one that ensures your product meets the quality standards your customers expect. All the same, designing good reliability tests is ...
Electronic Design

Heterogeneous 3D IC Test Vehicle Uses CoWoS Process

Altera Corp. and the Taiwan Semiconductor Manufacturing Company (TSMC) have jointly developed the world’s first heterogeneous 3D IC test vehicle using TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) ...