AI and HPC are fueling much-needed investment in panel-level tooling and processes. An insatiable demand for logic to memory ...

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux ...

Yole Group releases first edition of Back-End Equipment Industry Report; TCB and hybrid bonding to lead $1.3 billion market ...

Indium Corporation has launched WS-910, a water-soluble flip-chip flux developed for next-generation semiconductor packaging.

Flip Chip Packaging: An advanced semiconductor assembly technique where the chip is inverted, and solder bumps are directly connected to the substrate, reducing interconnect lengths and enhancing ...

Semiconductor Plating System Market Size & Growth Insights: According to the SNS Insider,“The Semiconductor Plating System Market size was valued at USD 5.58 billion in 2024 and is expected to reach ...

To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit ...

Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing applications, is faced with significant challenges from a heat dissipation ...

Gang Duan, who was named Intel’s inventor of the year in 2024, has left the U.S. company and taken a job at Samsung’s ...

Japanese IC substrate manufacturer Shinko Electric Industries has announced that due to poor sales of its main product, flip chip packaging substrates, the upcoming fiscal report for the fiscal ...

Automotive IDM Market is Segmented by Type (Advanced Packaging, Mainstream Packaging), by Application (Leadframe, MEMS & Sensors, Power Discretes and Modules, Flip Chip (FC), SiP Modules, Laminate).

Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps.