FEI (NASDAQ: FEIC) announced today its new Teneo VS™ scanning electron microscope (SEM), which offers a VolumeScope™ capability for life science applications. The Teneo platform tightly integrates FEI ...
“To improve transistor density and electronic performance, next-generation semiconductor devices are adopting three-dimensional architectures and feature sizes down to the few-nm regime, which require ...
Legos are not just for kids. They inspire engineers and scientists, too. Just ask Walt Akers, chief systems engineer for ...