EDN

Tessera designs chip scale package with Intel

Tessera Inc. Friday will unveil a new ultra-thin tri-fold stacked chip-scale package (CSP) co-developed with Intel Corp. for that firm's highest-density flash memory. Bruce McWilliams, president and ...
Business Wire

Samsung Electronics Unveils Ultra-Compact LED Chip Scale Packaging Technology at LIGHTFAIR International 2015

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced advanced chip scale packaging (CSP) technology for use in a ...
Business Wire

Samsung Introduces New Line-up of LED Components for Automotive Lighting, Featuring Chip-Scale Packaging

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...
Digi Times

Epistar to quadruple CSP LED capacity

LED epitaxial wafer and chip maker Epistar, in view of fast growing demand for CSP (chip scale package) LED chips used in TV backlighting, will expand production capacity to four times the current ...
Houston Chronicle

(BW) Staktek Announces Second Generation of High Performance Stakpak(R) Chip-Scale Package (CSP) Stacking with Enhanced Manufacturability

AUSTIN, Texas--(BUSINESS WIRE)--May 16, 2006--Staktek Holdings, Inc. (Nasdaq:STAK), a world-leading provider of intellectual property and services for next-generation, chip-stacking and module ...